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Shanghai Nickel's main contract has expanded, and now it has risen by more than 3% to 129,170 yuan/ton.Shenzhen Nanshan District Emergency Management Bureau: The cause of the deflagration accident in Shenzhen Bay Yuefu and the personnel placement are being carried out. On the afternoon of December 11th, a residential building in Shenzhen Bay Yuefu Phase II exploded. According to official reports, as of 18: 00 on the 11th, the open flame had been extinguished, resulting in one death and no other injuries. Today, the telephone operator of Shenzhen Nanshan District Emergency Management Bureau said that (cause investigation and personnel placement) are being carried out, and the specific information should wait for the official news announcement. (CBN)Goldman Sachs: The Bank of Japan has not reached the level where it can judge that it has enough confidence in the future. In this case, it is expected that the Bank of Japan will keep its policy interest rate unchanged at 0.25% at its meeting in December.

OPENAI API、CHATGPT、SORA流量基本恢复。Spring Festival travel rush's first day train tickets will be sold on 31st of this month. The student booking service was launched today. It was learned from China State Railway Group Co.,Ltd. today (12th) that Spring Festival travel rush will be launched on 14th of January next year in 2025, and Spring Festival travel rush's first day train tickets will be sold on 31st of this month. In view of students booking tickets during Spring Festival travel rush, Railway 12306 launched a new function today.Daiwa Capital Market raised the target price of Tesla from $285 to $420.

Thai Prime Minister: Energy prices will fall next year.Shanghai Nickel's main contract has expanded, and now it has risen by more than 3% to 129,170 yuan/ton.Intel: Breakthrough progress has been made in chip interconnection, and the inter-line capacitance has been reduced by 25%. Recently, Intel OEM announced a major breakthrough in on-chip interconnection technology. The latest subtractive Ruthenium interconnection technology of the company can reduce the inter-line capacitance by up to 25%, effectively improving the on-chip interconnection. According to reports, the subtractive ruthenium interconnection technology has achieved great progress in interconnection miniaturization by using ruthenium, a new, key and alternative metallization material, and using thin film resistivity and airgap. This process does not need an expensive photolithographic air gap exclusion zone around the via, and it can also avoid using a self-aligned via that is selectively etched. When the spacing is less than or equal to 25 nm, the air gap realized by reducing ruthenium interconnection technology can reduce the capacitance between lines by up to 25%, which can be used as a metallization scheme to replace copper damascene process in closely spaced layers. It is reported that this solution is expected to be applied in the future process nodes of Intel OEM. (Sina Technology)